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Aaron A. Hathaway

1 article on SOTA Papers

Physics

Flip-Chip NIS Cooling Refrigerates a Whole Silicon Chip

A 1,121-pair SINIS chain steers quasiparticles through bump bonds and limits trap backflow, cooling a 3.9 mm silicon chip to 70 mK.

cond-matphysics
Sep 7, 20265 min2608.17125

Co-authors

Northrop Grumman Microelectronics DesignApplications Team:Robert M. YoungZachary StegenJohn X. PrzybyszEdward R. EngbrechtJustin C. HackleyKirby B. MyersChristian C. ThorpeAurelius L. GraningerRobert MillerDiego A. MoralesRoberto D. CarcamoGlen WaltersJeric P. SaradNicholas F. PleimSeth WhitsittJoshua T. ShipmanAnil ErolMelissa G. LovingEvan DonohueCorey A. KegerreisBenjamin DalfortMoe S. KhalilChristopher PinionRandi JaramilloJohn MilinichikSandro J. Di GiacomoThomas ZoddaNilesh TralshawalaGregory R. BoydJonathan M. CochranKatherine A. MaddockMichael P. De FeoAaron A. PesetskiMarc E. Sherwin
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Data sourced from arXiv.org